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The choice of copper clad steel plating process

The choice of copper clad steel plating process

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  • Time of issue:2019-08-14 16:47
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(Summary description)Thespecialnatureofthewireprocessingindustrymakesthecopperplatingprocessdifferentfromconventionalsteelparts.Therefore,howtochooseacopperplatingprocesssuitableforwireprocessingisaveryimportantissue. Thechoiceoftheplatingprocessisusuallybasedontherequirementsoftheplatingproductitself.Thatis,theproductisfirstprocessedandthenelectroplated.Suchasthickness,brightness,hardnessanddispersibility.Therearealsorequirementsforcurrentefficiencyanddepositionspeed.Thenlookatthepre-plated,intermediateandsurfacecoatingsthatarerequiredforcopperplating. Thecharacteristicofwireprocessingandplatingisthattheprocessingofthewireandtheplatingprocessaresometimescarriedoutsimultaneously.Thatis,somearefirstpulledandthenplated,andsomearefirstplatedandthenpulled.Eventheplatingofthefinishedwireiscarriedoutunderthetractionofthetake-upmachine.Inadditiontotherequirementsofthecoatingaccordingtothedifferentusesofthewire,theselectedprocessshouldalsoconsidertheadaptabilityoftheplatingworkertothewirewalkingspeed,thenumberoftractionheads,andthelengthoftheprocessingline. FortheCO2gasshieldedweldingwire,sincetheamountofcopperadhesionontheweldingwireisstrictlylimited,forexample,thecoppercontentperunitvolumeshouldbewithin0.52(massfraction)ofthesolder,whichisanextremelythincoating,andthechemicalimmersionmethodisselected.Displacementofcoppercanmeettherequirements,butduetothetraditionalmethodusedinChinatoreplacecopperplating,itsbondingstrengthandcoatingcolorcannotmeettheproductrequirements.Andinpractice,theprocessoffirstimmersionplatinganddrawingisperformed,sothatthecopperlayerisstretchedandthinnedduringdrawingtomeetproductrequirements.Thismethodoftenoccurswhenthecoatingpeelsoffandthebottomisexposed.Therefore,choosingacopperplatingprocesswithgoodbondingandductilityisveryimportantforgasshieldedweldingwire. Beforetheemergenceofanewprocesscapableofsuccessfullyperformingcopperelectrolesscopperplatingonafinishedwire,itisstillonlypossibletoadoptaprocessoffirstpullingtheintermediatewirediameterandthendrawingthecopperintoafinishedproduct.Suitableforthisprocessshouldbecyanidecopperplatingormattacidcopperplating.Becausecyanideistootoxic,ithasrarelybeenusedinthemetallurgicalwireprocessingindustry.Atpresent,themorepopularmethodisstillchemicalcopperimmersioncopperandthenthickenedcopperplatingandthenpulled.Thethickcopperplatingusedisacidcopperplatingorpyrophosphatecopperplating.Intheflatwireprocessingindustry,chemicalcopperplatingisalsoused. Conventionalreplacementcopperplatingusesaprocessofcoppersulfateplussulfuricacid.Onlyinaveryshortperiodoftimecanbereplacedbyaverythincoating,whenthecopperplatingisthickened,thebondingforceisnotstrong.Ifthetimeofimmersioninsuchchemicaldisplacementplatingistoolong,notonlywillthethicknessoftheplatinglayerbeincreased,butalsotheplatinglayerwillbecomelooseandporous,theironmatrixwillalsocorrode,andthestrengthofthewirewillbegreatlyreduced.Theimprovedmethodistoaddanadditivehavingasurfaceretardingeffecttothereplacementcopperplatingsolution,sothatthereplacementprocessiscarriedoutinanorderlymanner.Theidealadditivealsohasacertainbrighteningeffect. Forwireproductsthatrequireacertainthicknessorevenathickercoating,caremustbetakentoreplacetheplatingwithareplacementcoating.Atleastforthethickeningofcopper,thereliableprocessshouldbepre-platedbyelectrochemicalmethods,atleastuntilthereisnoreliableprimerprocessforthickcopperplating.Thematurepre-platingprocessiscyanidecopper-platednickelandhighP-ratiopyrophosphatecopper.Weighingallkindsofadvantagesanddisadvantages,inthewiredrawingindustry,itisbettertousenickelplatingasthepre-platingbase.Forthickcopperplating,acidsulfatecopperplatingcanbeused.Thisisbecause,afterprocessadjustment,acidcopperplatingcanmeettherequirementsofhigh-speedplating.Thecurrentdensitycanreach30to50A/dm2,whichgreatlyincreasesthedepositionspeed.Incontrast,cyanidecopperplatingisnotsuitableforenvironmentalpollutionproblems,andpyrophosphatecopperplatingisnotonlycostlybutalsonotsuitableforoperationathighcurrentsduetoitscomplexcomposition.Testshaveshownthatinhigh-speedelectroplatinginacidcopperplating,whenthecurrentdensityisincreased,thedepositionrateoftheplatinglayerisalsoincreasedatthesametime,andtheapproximaterelationshipisshowninTable1.

The choice of copper clad steel plating process

(Summary description)Thespecialnatureofthewireprocessingindustrymakesthecopperplatingprocessdifferentfromconventionalsteelparts.Therefore,howtochooseacopperplatingprocesssuitableforwireprocessingisaveryimportantissue. Thechoiceoftheplatingprocessisusuallybasedontherequirementsoftheplatingproductitself.Thatis,theproductisfirstprocessedandthenelectroplated.Suchasthickness,brightness,hardnessanddispersibility.Therearealsorequirementsforcurrentefficiencyanddepositionspeed.Thenlookatthepre-plated,intermediateandsurfacecoatingsthatarerequiredforcopperplating. Thecharacteristicofwireprocessingandplatingisthattheprocessingofthewireandtheplatingprocessaresometimescarriedoutsimultaneously.Thatis,somearefirstpulledandthenplated,andsomearefirstplatedandthenpulled.Eventheplatingofthefinishedwireiscarriedoutunderthetractionofthetake-upmachine.Inadditiontotherequirementsofthecoatingaccordingtothedifferentusesofthewire,theselectedprocessshouldalsoconsidertheadaptabilityoftheplatingworkertothewirewalkingspeed,thenumberoftractionheads,andthelengthoftheprocessingline. FortheCO2gasshieldedweldingwire,sincetheamountofcopperadhesionontheweldingwireisstrictlylimited,forexample,thecoppercontentperunitvolumeshouldbewithin0.52(massfraction)ofthesolder,whichisanextremelythincoating,andthechemicalimmersionmethodisselected.Displacementofcoppercanmeettherequirements,butduetothetraditionalmethodusedinChinatoreplacecopperplating,itsbondingstrengthandcoatingcolorcannotmeettheproductrequirements.Andinpractice,theprocessoffirstimmersionplatinganddrawingisperformed,sothatthecopperlayerisstretchedandthinnedduringdrawingtomeetproductrequirements.Thismethodoftenoccurswhenthecoatingpeelsoffandthebottomisexposed.Therefore,choosingacopperplatingprocesswithgoodbondingandductilityisveryimportantforgasshieldedweldingwire. Beforetheemergenceofanewprocesscapableofsuccessfullyperformingcopperelectrolesscopperplatingonafinishedwire,itisstillonlypossibletoadoptaprocessoffirstpullingtheintermediatewirediameterandthendrawingthecopperintoafinishedproduct.Suitableforthisprocessshouldbecyanidecopperplatingormattacidcopperplating.Becausecyanideistootoxic,ithasrarelybeenusedinthemetallurgicalwireprocessingindustry.Atpresent,themorepopularmethodisstillchemicalcopperimmersioncopperandthenthickenedcopperplatingandthenpulled.Thethickcopperplatingusedisacidcopperplatingorpyrophosphatecopperplating.Intheflatwireprocessingindustry,chemicalcopperplatingisalsoused. Conventionalreplacementcopperplatingusesaprocessofcoppersulfateplussulfuricacid.Onlyinaveryshortperiodoftimecanbereplacedbyaverythincoating,whenthecopperplatingisthickened,thebondingforceisnotstrong.Ifthetimeofimmersioninsuchchemicaldisplacementplatingistoolong,notonlywillthethicknessoftheplatinglayerbeincreased,butalsotheplatinglayerwillbecomelooseandporous,theironmatrixwillalsocorrode,andthestrengthofthewirewillbegreatlyreduced.Theimprovedmethodistoaddanadditivehavingasurfaceretardingeffecttothereplacementcopperplatingsolution,sothatthereplacementprocessiscarriedoutinanorderlymanner.Theidealadditivealsohasacertainbrighteningeffect. Forwireproductsthatrequireacertainthicknessorevenathickercoating,caremustbetakentoreplacetheplatingwithareplacementcoating.Atleastforthethickeningofcopper,thereliableprocessshouldbepre-platedbyelectrochemicalmethods,atleastuntilthereisnoreliableprimerprocessforthickcopperplating.Thematurepre-platingprocessiscyanidecopper-platednickelandhighP-ratiopyrophosphatecopper.Weighingallkindsofadvantagesanddisadvantages,inthewiredrawingindustry,itisbettertousenickelplatingasthepre-platingbase.Forthickcopperplating,acidsulfatecopperplatingcanbeused.Thisisbecause,afterprocessadjustment,acidcopperplatingcanmeettherequirementsofhigh-speedplating.Thecurrentdensitycanreach30to50A/dm2,whichgreatlyincreasesthedepositionspeed.Incontrast,cyanidecopperplatingisnotsuitableforenvironmentalpollutionproblems,andpyrophosphatecopperplatingisnotonlycostlybutalsonotsuitableforoperationathighcurrentsduetoitscomplexcomposition.Testshaveshownthatinhigh-speedelectroplatinginacidcopperplating,whenthecurrentdensityisincreased,thedepositionrateoftheplatinglayerisalsoincreasedatthesametime,andtheapproximaterelationshipisshowninTable1.

  • Categories:Company news
  • Author:
  • Origin:
  • Time of issue:2019-08-14 16:47
  • Views:8
Information
The special nature of the wire processing industry makes the copper plating process different from conventional steel parts. Therefore, how to choose a copper plating process suitable for wire processing is a very important issue.
 
The choice of the plating process is usually based on the requirements of the plating product itself. That is, the product is first processed and then electroplated. Such as thickness, brightness, hardness and dispersibility. There are also requirements for current efficiency and deposition speed. Then look at the pre-plated, intermediate and surface coatings that are required for copper plating.
 
The characteristic of wire processing and plating is that the processing of the wire and the plating process are sometimes carried out simultaneously. That is, some are first pulled and then plated, and some are first plated and then pulled. Even the plating of the finished wire is carried out under the traction of the take-up machine. In addition to the requirements of the coating according to the different uses of the wire, the selected process should also consider the adaptability of the plating worker to the wire walking speed, the number of traction heads, and the length of the processing line.
 
For the CO2 gas shielded welding wire, since the amount of copper adhesion on the welding wire is strictly limited, for example, the copper content per unit volume should be within 0.52 (mass fraction) of the solder, which is an extremely thin coating, and the chemical immersion method is selected. Displacement of copper can meet the requirements, but due to the traditional method used in China to replace copper plating, its bonding strength and coating color can not meet the product requirements. And in practice, the process of first immersion plating and drawing is performed, so that the copper layer is stretched and thinned during drawing to meet product requirements. This method often occurs when the coating peels off and the bottom is exposed. Therefore, choosing a copper plating process with good bonding and ductility is very important for gas shielded welding wire.
 
Before the emergence of a new process capable of successfully performing copper electroless copper plating on a finished wire, it is still only possible to adopt a process of first pulling the intermediate wire diameter and then drawing the copper into a finished product. Suitable for this process should be cyanide copper plating or matt acid copper plating. Because cyanide is too toxic, it has rarely been used in the metallurgical wire processing industry. At present, the more popular method is still chemical copper immersion copper and then thickened copper plating and then pulled. The thick copper plating used is acid copper plating or pyrophosphate copper plating. In the flat wire processing industry, chemical copper plating is also used.
 
Conventional replacement copper plating uses a process of copper sulfate plus sulfuric acid. Only in a very short period of time can be replaced by a very thin coating, when the copper plating is thickened, the bonding force is not strong. If the time of immersion in such chemical displacement plating is too long, not only will the thickness of the plating layer be increased, but also the plating layer will become loose and porous, the iron matrix will also corrode, and the strength of the wire will be greatly reduced. The improved method is to add an additive having a surface retarding effect to the replacement copper plating solution, so that the replacement process is carried out in an orderly manner. The ideal additive also has a certain brightening effect.
 
For wire products that require a certain thickness or even a thicker coating, care must be taken to replace the plating with a replacement coating. At least for the thickening of copper, the reliable process should be pre-plated by electrochemical methods, at least until there is no reliable primer process for thick copper plating. The mature pre-plating process is cyanide copper-plated nickel and high P-ratio pyrophosphate copper. Weighing all kinds of advantages and disadvantages, in the wire drawing industry, it is better to use nickel plating as the pre-plating base. For thick copper plating, acid sulfate copper plating can be used. This is because, after process adjustment, acid copper plating can meet the requirements of high-speed plating. The current density can reach 30 to 50 A/dm2, which greatly increases the deposition speed. In contrast, cyanide copper plating is not suitable for environmental pollution problems, and pyrophosphate copper plating is not only costly but also not suitable for operation at high currents due to its complex composition. Tests have shown that in high-speed electroplating in acid copper plating, when the current density is increased, the deposition rate of the plating layer is also increased at the same time, and the approximate relationship is shown in Table 1.

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